The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jul. 04, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Ting-Yu Yeh, Hsinchu, TW;
Cing-He Chen, Taoyuan City, TW;
Kuo-Chiang Ting, Hsinchu City, TW;
Weiming Chris Chen, Taipei City, TW;
Chia-Hao Hsu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A manufacturing method of a semiconductor package includes the following steps. An encapsulated semiconductor package is provided on a substrate. A heat dissipation sheet is cut into a plurality of heat dissipation films. The plurality of heat dissipation films are attached on the encapsulated semiconductor package, wherein the plurality of heat dissipation films jointly cover an upper surface of the encapsulated semiconductor package. A cover lid is provided on the substrate, wherein the cover lid is in contact with the plurality of heat dissipation films.