The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Mar. 22, 2022
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Bo-Jiun Yang, Hsinchu, TW;
Wen-Sung Hsu, Hsinchu, TW;
Tai-Yu Chen, Hsinchu, TW;
Sheng-Liang Kuo, Hsinchu, TW;
Chia-Hao Hsu, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 21/4817 (2013.01); H01L 23/427 (2013.01); H01L 23/433 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1611 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/1632 (2013.01);
Abstract
A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.