Hsinchu, Taiwan

Bo-Jiun Yang

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 4.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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5 patents (USPTO):Explore Patents

Title: The Innovative Mind of Bo-Jiun Yang

Introduction

Bo-Jiun Yang is a prominent inventor based in Hsinchu, Taiwan. With a remarkable portfolio of three patents, Yang is making significant contributions to the field of semiconductor technology, specifically in packaging solutions that enhance performance and efficiency.

Latest Patents

Among his latest inventions is a patent for a "Semiconductor package having liquid-cooling lid." This innovative semiconductor package comprises a substrate, a die mounted in a flip-chip fashion, and a specially designed lid that incorporates a liquid-cooling channel. The cooling channel allows for efficient circulation of coolant, optimizing the thermal management of the semiconductor package.

Another notable invention is a "Semiconductor device with dummy thermal features on interposer." In this patent, Yang describes a semiconductor device featuring a bottom package and a top package, which are stacked with an interposer in between. The design includes dummy thermal features on the interposer that are surrounded by peripheral solder balls, enhancing thermal performance while ensuring electrical connectivity.

Career Highlights

Bo-Jiun Yang is associated with MediaTek Corporation, a leading global semiconductor company renowned for its innovative technology solutions. His work at MediaTek focuses on advancing semiconductor packaging techniques, significantly impacting the industry and contributing to the company's reputation for innovation.

Collaborations

In his endeavors, Yang collaborates closely with his colleague, Chia-Hao Hsu. Their combined expertise and innovative thinking play a crucial role in the development of cutting-edge semiconductor solutions, further establishing their impact in the technological landscape.

Conclusion

Bo-Jiun Yang exemplifies the spirit of innovation with his inventive contributions to semiconductor packaging technology. As he continues to push the boundaries of what is possible, his work not only enhances the functionality of semiconductor devices but also inspires future advancements in the industry.

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