Mediatek Corporation

Bo-Jiun Yang

Tai-Yu Chen

Chia-Hao Hsu

Sheng-Liang Kuo

Wen-Sung Hsu

Shih-Chin Lin

Jia-Wei Fang

Yu-Chia Chang

Kun-Ting Hung

Shun-Yao Yang

Ta-Chang Liao

Chih-Fu Tsai

Yen-Hwei Hsieh

An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block. The thermal control circuit performs thermal control on the first functional block to prevent the first functional block from overheating and inducing abnormal function operations, by monitoring the temperature sensing result and by trying to prevent the temperature sensing result from exceeding first temperature upper-limit, wherein the first temperature upper-limit is configurable with respect to per-functional-block thermal operation capability of the first functional block.

Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control method

A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.

Semiconductor device and manufacturing method thereof

A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

Semiconductor package having liquid-cooling lid

A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

Semiconductor device with dummy thermal features on interposer

Growing community of inventors

Hsinchu, Taiwan

Bo-Jiun Yang