The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Feb. 22, 2023
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Yu-Jin Li, Hsinchu City, TW;
Bo-Jiun Yang, Hsinchu City, TW;
Tai-Yu Chen, Hsinchu City, TW;
Tsung-Yu Pan, Hsinchu City, TW;
Chun-Yin Lin, Hsinchu City, TW;
Assignee:
MEDIATEK INC., Hsinchu City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 70/02 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 74/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 70/02 (2026.01); H10W 74/01 (2026.01); H10W 74/111 (2026.01); H10W 72/07354 (2026.01); H10W 72/342 (2026.01); H10W 74/00 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.