Chung-Fa Lee

Title: Innovations by Chung-Fa Lee: Patents and Contributions in Semiconductor Technology

Introduction: Chung-Fa Lee, an accomplished inventor, hails from Dacun, Taiwan. With a remarkable portfolio comprising seven patents, Lee has significantly impacted the semiconductor industry through his innovative designs and solutions.

Latest Patents: Among his notable contributions are two latest patents that focus on enhancing thermal interfaces in semiconductor packages. The first patent describes a semiconductor package featuring a base with a top and bottom surface, where a first semiconductor chip is mounted in a flip-chip fashion. The design includes a second semiconductor chip stacked on the first, along with an in-package heat dissipating element made from a dummy silicon die. This configuration improves thermal management through a high-thermal conductive die attach film and a molding compound that encapsulates the semiconductor dies.

The second patent presents an advanced semiconductor package that incorporates a radio-frequency (RF) module embedded near the upper surface of the base. An integrated circuit (IC) die is mounted on the lower surface in a flip-chip manner, allowing efficient heat dissipation. This package features conductive structures around the IC die and a metal thermal interface layer for optimal thermal performance.

Career Highlights: Chung-Fa Lee currently works at MediaTek Corporation, a leading global provider of semiconductor solutions. His role at MediaTek highlights his dedication to advancing technology in a highly competitive field.

Collaborations: Throughout his career, Lee has had the opportunity to collaborate with esteemed colleagues such as Tai-Yu Chen and Chia-Hao Hsu. These collaborations have likely contributed to the innovative success reflected in his patent portfolio.

Conclusion: Chung-Fa Lee's contributions to the field of semiconductor technology demonstrate his commitment to developing solutions that enhance performance and efficiency. His innovative patents continue to play a crucial role in the advancement of semiconductor packages, setting benchmarks in thermal management and functionality.