Growing community of inventors

Dacun, Taiwan

Chung-Fa Lee

Average Co-Inventor Count = 5.30

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 11

Chung-Fa LeeTai-Yu Chen (7 patents)Chung-Fa LeeChia-Hao Hsu (4 patents)Chung-Fa LeeChi-Yuan Chen (4 patents)Chung-Fa LeeShiann-Tsong Tsai (4 patents)Chung-Fa LeeHsing-Chih Liu (4 patents)Chung-Fa LeeYao-Pang Hsu (4 patents)Chung-Fa LeeWen-Sung Hsu (3 patents)Chung-Fa LeeShih-Chin Lin (3 patents)Chung-Fa LeeChung-Fa Lee (7 patents)Tai-Yu ChenTai-Yu Chen (44 patents)Chia-Hao HsuChia-Hao Hsu (77 patents)Chi-Yuan ChenChi-Yuan Chen (25 patents)Shiann-Tsong TsaiShiann-Tsong Tsai (22 patents)Hsing-Chih LiuHsing-Chih Liu (21 patents)Yao-Pang HsuYao-Pang Hsu (7 patents)Wen-Sung HsuWen-Sung Hsu (63 patents)Shih-Chin LinShih-Chin Lin (22 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Mediatek Corporation (7 from 4,763 patents)


7 patents:

1. 11967570 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

2. 11705413 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

3. 11302657 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

4. 11227846 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

5. 9252068 - Semiconductor package

6. 9184107 - Semiconductor package

7. 9000581 - Semiconductor package

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as of
12/4/2025
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