logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9252068 B1

PDFFull Text
Date of Patent:
Feb. 02, 2016

Filed:

Feb. 02, 2015

Semiconductor package

Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Tai-Yu Chen, Taipei, TW;

Chung-Fa Lee, Dacun Township, Changhua County, TW;

Wen-Sung Hsu, Zhubei, TW;

Shih-Chin Lin, Taoyuan, TW;

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Roy Potter

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 23/49816 (2013.01); H01L 24/97 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor package with reduced warpage problem is provided, including: a circuit board, having opposing first and second surfaces; a semiconductor chip, formed over a center portion of the first surface of the circuit board; a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension; a non-planar shaped heat spreading layer, formed over the spacer; an encapsulant layer, formed, over the circuit board, filling spaces between the non-planar shaped heat spreading layer and the circuit board; and a plurality of solder balls, formed over the second surface of the circuit board.

Find Patent Forward Citations

Loading…