This inventor holds 22 USPTO granted patents and 5 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, Ultratera Corporation, Utac (Taiwan) Corporation. Active years: 2004-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
14 out of 5,115 
3 out of 27 
3 out of 4 Years Active: 2004-2024
Areas of Expertise:
Title: Innovations and Contributions of Shiann-Tsong Tsai in Semiconductor Technology
Introduction: Shiann-Tsong Tsai is a notable inventor based in Hsinchu, Taiwan, with an impressive portfolio that includes 22 patents. His work primarily revolves around advancements in semiconductor packaging, which play a crucial role in enhancing the performance and efficiency of electronic devices.
Latest Patents: Among his latest patents is a semiconductor package featuring an improved thermal interface between the semiconductor die and the heat spreading structure. This innovative design consists of a base with a top surface and a bottom surface. It includes a flip-chip mounted first semiconductor chip, a stacked second semiconductor chip, and an in-package heat dissipating element made from a dummy silicon die that is adhered to the second semiconductor chip using a high-thermal conductive die attach film. The overall assembly is encapsulated with a molding compound that securely protects the dies and heat dissipating element.
Another of his significant patents is a semiconductor package equipped with an electromagnetic interference (EMI) shielding structure. This invention incorporates a carrier substrate with a semiconductor die mounted on its top surface. It features bonding wires connecting the semiconductor die to the substrate, an insulating material that encapsulates these wires, and a component with a metal layer. This metal layer is also connected through second bonding wires, forming an EMI shielding structure that enhances the package's reliability and effectiveness in reducing interference.
Career Highlights: Shiann-Tsong Tsai's career has seen him contribute to prominent companies in the semiconductor industry, including MediaTek Corporation and Ultratera Corporation. His expertise in semiconductor packaging has helped improve device performance, making significant waves in the technological landscape.
Collaborations: Throughout his career, Shiann-Tsong Tsai has worked alongside talented colleagues, including Chia-Hao Hsu and Tai-Yu Chen. Together, they have contributed to innovative projects that advance the state of semiconductor technologies.
Conclusion: With his extensive experience and considerable contributions to the field, Shiann-Tsong Tsai stands out as a leading inventor in semiconductor technology. His patents reflect a commitment to excellence and innovation, paving the way for future developments in electronic design and manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile