The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Feb. 12, 2018
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventor:
Shiann-Tsong Tsai, Hsinchu, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/00 (2013.01); H01L 23/3135 (2013.01); H01L 23/34 (2013.01); H01L 23/4334 (2013.01); H01L 23/4952 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 24/45 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45541 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4901 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting an active surface of the semiconductor die to the top surface of the carrier substrate, an insulating material encapsulating the plurality of bonding wires, a component mounted on the insulating material, and a molding compound covering the top surface of the carrier substrate and encapsulating the semiconductor die, the plurality of bonding wires, the component and the insulating material.