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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10847488 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Feb. 12, 2018

Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires

Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventor:

Shiann-Tsong Tsai, Hsinchu, TW;

Assignee:

MediaTek Inc., Hsin-Chu, TW;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Farun Lu

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/00 (2013.01); H01L 23/3135 (2013.01); H01L 23/34 (2013.01); H01L 23/4334 (2013.01); H01L 23/4952 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 24/45 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45541 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4901 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting an active surface of the semiconductor die to the top surface of the carrier substrate, an insulating material encapsulating the plurality of bonding wires, a component mounted on the insulating material, and a molding compound covering the top surface of the carrier substrate and encapsulating the semiconductor die, the plurality of bonding wires, the component and the insulating material.

Find Patent Forward Citations

Tsai, Shiann-Tsong. (2020). Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires (U.S. Patent No. 10847488). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10847488

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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