The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Nov. 11, 2016
Mediatek Inc., Hsin-Chu, TW;
Shiann-Tsong Tsai, Hsinchu, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
A semiconductor package includes a circuit board, a semiconductor chip, a heat spreading layer, an encapsulant layer, a plurality of conductive connections, and a plurality of solder balls. The circuit board includes opposite first and second surfaces and a plurality of through holes. The semiconductor chip is formed over a center portion of the first surface of the circuit board, having an active surface facing the circuit board. The heat spreading layer is formed over the semiconductor chip. The encapsulant layer is formed over the circuit board, covering heat spreading layer, the semiconductor chip, and the circuit board. The plurality of conductive connections respectively passes through the through holes and electrically connecting the semiconductor chip with the circuit board. The plurality of solder balls are formed over the second surface of the circuit board.