The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Nov. 06, 2017
Mediatek Inc., Hsin-Chu, TW;
Shiann-Tsong Tsai, Hsinchu, TW;
MediaTek Inc., Hsin-Chu, TW;
Abstract
A method for fabricating a semiconductor package is provided. Semiconductor dice are disposed on a top surface of a carrier. Each of the semiconductor dice has an active surface and a bottom surface that is opposite to the active surface. Input/output (I/O) pads are distributed on the active surface. Interconnect features are printed on the carrier and on the active surface of each of the semiconductor dice. The top surface of the carrier, the semiconductor dice and the interconnect features is encapsulated with an encapsulant. The carrier is then removed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile