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Ultratera Corporation

USPTO Granted Patents = 27

% Expired Patents = 37.0

Forward Citations = 394

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20 inventors (with patents filed for the assignee):

Chung-Che Tsai (11 out of 17 patents)

Wei-Heng Shan (7 out of 7 patents)

Jin-Chuan Bai (6 out of 8 patents)

4. Huan-Ping Su (5 out of 8 patents)

5. Shiann-Tsong Tsai (3 out of 22 patents)

6. Yu-Ming Hsu (3 out of 5 patents)

7. Wen-Lung Wu (3 out of 3 patents)

8. Kuen-Huang Chen (3 out of 3 patents)

9. Wen-Sheng Su (3 out of 3 patents)

10. Chin-Hsing Lin (3 out of 3 patents)

11. Ming-Sung Tsai (3 out of 5 patents)

12. Chih-Horng Horng (2 out of 6 patents)

13. Sung-Jin Kim (2 out of 2 patents)

14. Chong-Ren Maa (2 out of 8 patents)

15. Wan-Kuo Chih (2 out of 4 patents)

Core Competencies:

Solder Joint

Ball Grid Array

Semiconductor Package

Thermal Management

Fabrication Method

Printed Circuit Board

Encapsulation

Chip Carrier

Test Fixture

Stacked Chip Package

Bonding Pads

Mold Structure

27 patents: Sort by Forward Citations

1. 7224073 - Substrate for solder joint (2007-05-29),

2. 7122407 - Method for fabricating window ball grid array semiconductor package (2006-10-17),

3. 7091623 - Multi-chip semiconductor package and fabrication method thereof (2006-08-15),

4. 7080447 - Method of manufacturing solder mask of printed circuit board (2006-07-25),

5. 6968613 - Fabrication method of circuit board (2005-11-29),

6. 6964888 - Semiconductor device and method for fabricating the same (2005-11-15),

7. 6956741 - Semiconductor package with heat sink (2005-10-18),

8. 6933178 - Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package (2005-08-23),

9. 6911604 - Bonding pads of printed circuit board capable of holding solder balls securely (2005-06-28),

10. 6897566 - Encapsulated semiconductor package free of chip carrier (2005-05-24),

11. 6879030 - Strengthened window-type semiconductor package (2005-04-12),

12. 6869824 - Fabrication method of window-type ball grid array semiconductor package (2005-03-22),

13. 6859056 - Test fixture for semiconductor package and test method of using the same (2005-02-22),

14. 6857865 - Mold structure for package fabrication (2005-02-22),

15. 6849932 - Double-sided thermally enhanced IC chip package (2005-02-01),

Ultratera Corporation is a technology-focused organization based in China, specializing in advanced materials and innovative solutions for various industries. The company is dedicated to the research and development of cutting-edge technologies, particularly in the fields of electronics, telecommunications, and energy. Ultratera aims to enhance product performance and sustainability through its expertise in material science and engineering, positioning itself as a key player in the global technology landscape.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

27 Patents

#2 in

#1,117 in China

#23,984 in the World

Ultratera Corporation

Forward Citations = 394

20 inventors:

Chung-Che Tsai (11 out of 17 patents)

Wei-Heng Shan (7 out of 7 patents)

Jin-Chuan Bai (6 out of 8 patents)

4. Huan-Ping Su (5 out of 8 patents)

5. Shiann-Tsong Tsai (3 out of 22 patents)

Please report any incorrect information to [email protected]

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