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Ultratera Corporation

USPTO Granted Patents = 27

Forward Citations = 390

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20 inventors (with patents filed for the assignee):

Chung-Che Tsai (11 out of 17 patents)

Wei-Heng Shan (7 out of 7 patents)

Jin-Chuan Bai (6 out of 8 patents)

4. Huan-Ping Su (5 out of 8 patents)

5. Shiann-Tsong Tsai (3 out of 22 patents)

6. Yu-Ming Hsu (3 out of 5 patents)

7. Wen-Lung Wu (3 out of 3 patents)

8. Kuen-Huang Chen (3 out of 3 patents)

9. Wen-Sheng Su (3 out of 3 patents)

10. Chin-Hsing Lin (3 out of 3 patents)

11. Ming-Sung Tsai (3 out of 5 patents)

12. Chih-Horng Horng (2 out of 6 patents)

13. Sung-Jin Kim (2 out of 2 patents)

14. Chong-Ren Maa (2 out of 8 patents)

15. Wan-Kuo Chih (2 out of 4 patents)

27 patents: Sort by Forward Citations

1. 7224073 - Substrate for solder joint (2007-05-29),

2. 7122407 - Method for fabricating window ball grid array semiconductor package (2006-10-17),

3. 7091623 - Multi-chip semiconductor package and fabrication method thereof (2006-08-15),

4. 7080447 - Method of manufacturing solder mask of printed circuit board (2006-07-25),

5. 6968613 - Fabrication method of circuit board (2005-11-29),

6. 6964888 - Semiconductor device and method for fabricating the same (2005-11-15),

7. 6956741 - Semiconductor package with heat sink (2005-10-18),

8. 6933178 - Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package (2005-08-23),

9. 6911604 - Bonding pads of printed circuit board capable of holding solder balls securely (2005-06-28),

10. 6897566 - Encapsulated semiconductor package free of chip carrier (2005-05-24),

11. 6879030 - Strengthened window-type semiconductor package (2005-04-12),

12. 6869824 - Fabrication method of window-type ball grid array semiconductor package (2005-03-22),

13. 6859056 - Test fixture for semiconductor package and test method of using the same (2005-02-22),

14. 6857865 - Mold structure for package fabrication (2005-02-22),

15. 6849932 - Double-sided thermally enhanced IC chip package (2005-02-01),

Ultratera Corporation is a leading technology company specializing in next-generation solutions for data storage and management. With a focus on delivering high-performance and scalable storage infrastructure, Ultratera empowers businesses by enabling efficient data processing and insights. Our cutting-edge products and services ensure secure and reliable storage environments for diverse industries such as finance, healthcare, and e-commerce. Visit our website for more information and explore how Ultratera can transform your data management operations.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

27 Patents

#5 in

#1,002 in China

#23,291 in the World

Ultratera Corporation

Forward Citations = 390

20 inventors:

Chung-Che Tsai (11 out of 17 patents)

Wei-Heng Shan (7 out of 7 patents)

Jin-Chuan Bai (6 out of 8 patents)

4. Huan-Ping Su (5 out of 8 patents)

5. Shiann-Tsong Tsai (3 out of 22 patents)

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