Company Filing History:
3 out of 27 
1 out of 3,603 
1 out of 1,096 
Years Active: 2000-2006
Title: Innovations by Yu-Ming Hsu
Introduction
Yu-Ming Hsu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of five patents. His work focuses on enhancing the reliability and structural integrity of semiconductor packages.
Latest Patents
One of his latest patents is a multi-chip semiconductor package and fabrication method. This innovation involves preparing a substrate with an upper and lower surface, where at least a first chip is mounted on the upper surface. A non-conductive material is applied over a predetermined area on the first chip and the substrate. A second chip is then mounted on this non-conductive material, ensuring that it is supported without causing conventional chip-crack problems. This design effectively assures structural intactness and reliability for fabricated package products.
Another notable patent is the strengthened window-type semiconductor package. In this design, a substrate with an opening is mounted with at least one chip, where the active surface of the chip is partly exposed to the opening. An elastic non-conductive material is applied over the chip, excluding the active surface. This innovation prevents cracking, particularly at corners and edges, during subsequent fabrication processes.
Career Highlights
Yu-Ming Hsu has worked with notable companies such as Ultratera Corporation and Macronix International Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.
Collaborations
Some of his coworkers include Shiann-Tsong Tsai and Wen-Lung Wu. Their collaboration has likely fostered a productive environment for innovation in semiconductor packaging.
Conclusion
Yu-Ming Hsu's contributions to semiconductor packaging through his patents demonstrate his commitment to advancing technology in this field. His innovative designs enhance the reliability and performance of semiconductor products, making a significant impact on the industry.