Company Filing History:
Years Active: 2004-2006
Title: Innovations of Chin-Hsing Lin in Semiconductor Packaging
Introduction
Chin-Hsing Lin is a notable inventor based in Hsinchu, Taiwan, recognized for his contributions to semiconductor packaging technology. With a total of three patents to his name, Lin has made significant advancements in the field, particularly in the design and fabrication of multi-chip semiconductor packages.
Latest Patents
One of Lin's latest patents is titled "Multi-chip semiconductor package and fabrication method thereof." This invention provides a novel approach to mounting multiple chips on a substrate, utilizing a non-conductive material to support the second chip without causing conventional chip-crack problems. This innovation ensures structural integrity and reliability in the final package products.
Another significant patent is the "Strengthened window-type semiconductor package." This design features a substrate with an opening that allows an active surface of the chip to be partially exposed. By applying an elastic non-conductive material over the chip, Lin's invention prevents cracking during thermal stress, particularly at vulnerable corner and edge positions.
Career Highlights
Chin-Hsing Lin is currently employed at Ultratera Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in enhancing the performance and reliability of semiconductor packages, making him a valuable asset to his company.
Collaborations
Lin collaborates with talented coworkers, including Shiann-Tsong Tsai and Yu-Ming Hsu, who contribute to the innovative environment at Ultratera Corporation.
Conclusion
Chin-Hsing Lin's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to innovation in the field. His work not only addresses existing challenges but also paves the way for future advancements in semiconductor technology.