Company Filing History:
Years Active: 2004-2006
Title: Innovations by Inventor Wen-Lung Wu
Introduction
Wen-Lung Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology.
Latest Patents
One of his latest patents is a multi-chip semiconductor package and fabrication method. This invention involves a substrate with an upper and lower surface, where at least a first chip is mounted on the upper surface. A non-conductive material is applied over a predetermined area on the first chip and the substrate. A second chip is then mounted on the non-conductive material, ensuring that it is supported without causing conventional chip-crack problems. This design effectively enhances the structural integrity and reliability of the fabricated package products.
Another significant patent by Wu is the strengthened window-type semiconductor package. This invention features a substrate with an opening, where at least one chip is mounted in a way that its active surface is partly exposed. The chip is electrically connected to the substrate through bonding wires that are formed through the opening. An elastic non-conductive material is applied over the chip, excluding the active surface, and encapsulated with upper and lower encapsulants. This design prevents cracking, particularly at corners and edges, during thermal stress in subsequent fabrication processes.
Career Highlights
Wen-Lung Wu is currently employed at Ultratera Corporation, where he continues to innovate in semiconductor technology. His work has significantly impacted the industry, particularly in enhancing the reliability and performance of semiconductor packages.
Collaborations
Wu collaborates with talented individuals such as Shiann-Tsong Tsai and Yu-Ming Hsu, contributing to a dynamic and innovative work environment.
Conclusion
Wen-Lung Wu's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to innovation. His work not only addresses current challenges in the field but also paves the way for future advancements in technology.