Hsinchu, Taiwan

Wei-Heng Shan


Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 141(Granted Patents)


Company Filing History:


Years Active: 2003-2005

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7 patents (USPTO):Explore Patents

Title: Innovations of Wei-Heng Shan

Introduction

Wei-Heng Shan is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of printed circuit board technology and packaging solutions. With a total of seven patents to his name, Shan's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is for bonding pads of printed circuit boards capable of holding solder balls securely. This invention involves a printed circuit board that comprises a substrate, a conductive pattern on the substrate's surface, and a solder mask that covers the conductive pattern. The conductive pattern features a bonding pad, and the solder mask has an opening that corresponds to the bonding pad's location, allowing a solder ball to be securely held in place.

Another notable patent is a mold structure for package fabrication. This mold structure includes a top mold, a fixture, and a bottom mold. The top mold is designed with an upwardly recessed portion, while the fixture has multiple downwardly recessed portions. The bottom mold contains a recessed cavity for receiving the fixture, which is engaged with the top mold. A resilient member is positioned between the fixture and the bottom mold's cavity, providing a force that ensures proper positioning of the fixture during the molding process, thus preventing chip cracks.

Career Highlights

Wei-Heng Shan is currently employed at Ultratera Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of printed circuit boards and packaging methods.

Collaborations

Shan has collaborated with notable coworkers, including Chung-Che Tsai and Huan-Ping Su, contributing to various projects and innovations within the company.

Conclusion

Wei-Heng Shan's contributions to the field of technology through his patents and work at Ultratera Corporation highlight his role as a significant inventor. His innovations in printed circuit boards and packaging solutions continue to influence the industry positively.

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