Company Filing History:
Years Active: 2004-2006
Title: Innovations of Kuen-Huang Chen in Semiconductor Packaging
Introduction
Kuen-Huang Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to enhancing the reliability and structural integrity of semiconductor devices.
Latest Patents
One of his latest patents is titled "Multi-chip semiconductor package and fabrication method thereof." This invention provides a method for mounting multiple chips on a substrate while ensuring that the second chip is supported on a non-conductive material, effectively preventing conventional chip-crack problems. This innovation enhances the structural intactness and reliability of the fabricated package products.
Another significant patent is the "Strengthened window-type semiconductor package." This invention involves a substrate with an opening that allows an active surface of a chip to be exposed while being electrically connected to the substrate. The application of an elastic non-conductive material helps prevent cracking during fabrication processes, particularly at corners and edges that experience greater thermal stress.
Career Highlights
Kuen-Huang Chen is currently employed at Ultratera Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the field and addressing common challenges faced in semiconductor packaging.
Collaborations
Kuen-Huang Chen collaborates with talented individuals such as Shiann-Tsong Tsai and Yu-Ming Hsu, contributing to a dynamic team focused on innovation and excellence in semiconductor technology.
Conclusion
Kuen-Huang Chen's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation and reliability in technology. His work continues to influence the industry positively, ensuring advancements in semiconductor device performance.