The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
Jun. 24, 2002
Huan-ping Su, Hsinchu, TW;
Huan-Ping Su, Hsinchu, TW;
Ultra Tera Corporation, Hsinchu, TW;
Abstract
A semiconductor package and a method for fabricating the same are proposed. A chip has an active surface, and an opposing non-active surface. A plurality of conductive elements are mounted on the active surface and electrically connected to the chip. A first encapsulant is formed on the active surface of the chip, for encapsulating the active surface and conductive elements, wherein end portions of the conductive elements are exposed to outside of the first encapsulant, and adapted to be recessed in position with respect to an exposed surface of the first encapsulant. A plurality of conductive media are implanted at end portions of the conductive elements, allowing the chip to be electrically connected to an external device by the conductive elements and conductive media. A second encapsulant is formed on the non-active surface of the chip, and cooperates with the first encapsulant to provide mechanical strength for the semiconductor package.