The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Aug. 24, 2004
Sung-jin Kim, Hsin-Chu, TW;
Chih-horng Horng, Hsin-Chu, TW;
Ming-sung Tsai, Hsin-Chu, TW;
Chung-ta Yang, Hsin-Chu, TW;
Sung-Jin Kim, Hsin-Chu, TW;
Chih-Horng Horng, Hsin-Chu, TW;
Ming-Sung Tsai, Hsin-Chu, TW;
Chung-Ta Yang, Hsin-Chu, TW;
Ultra Tera Corporation, Hsin-chu, TW;
Abstract
A method for fabricating a window ball grid array (WBGA) semiconductor package is provided. A substrate is prepared having a through opening and ball pads on a lower surface thereof. A chip is mounted over the opening of the substrate via an adhesive, with gaps not applied with the adhesive left between the chip and substrate. The chip is electrically connected to the substrate via bonding wires through the opening. A spacer is attached to the lower surface of the substrate and has a through hole and a recessed portion around the through hole. During molding, the spacer is clamped between the substrate and a mold, and the recessed portion is located between the ball pads and the opening, such that a resin material for forming an encapsulation body encapsulates the chip and flows through the gaps to encapsulate the bonding wires. The recessed portion holds resin flash therein.