Location History:
- Keelung, TW (2002 - 2006)
- Hsin-Chu, TW (2006)
Company Filing History:
Years Active: 2002-2006
Title: The Innovative Contributions of Ming-Sung Tsai
Introduction
Ming-Sung Tsai is a notable inventor based in Keelung, Taiwan. He has made significant contributions to the field of semiconductor packaging and printed circuit board technology. With a total of 5 patents to his name, Tsai's work has had a considerable impact on the industry.
Latest Patents
One of his latest patents is a method for fabricating a window ball grid array (WBGA) semiconductor package. This innovative method involves preparing a substrate with a through opening and ball pads on its lower surface. A chip is mounted over the opening using an adhesive, leaving gaps between the chip and substrate. The chip is then electrically connected to the substrate via bonding wires through the opening. A spacer is attached to the lower surface of the substrate, which plays a crucial role during the molding process. The spacer ensures that the resin material encapsulates the chip and flows through the gaps to encapsulate the bonding wires, effectively holding resin flash.
Another significant patent is a method of manufacturing a solder mask for printed circuit boards. This method is designed to apply a solder mask on a substrate surface that features a conductor pattern. The process includes disposing a layer of semi-solid solder mask material on the substrate, applying pressure and baking treatment to cure the material, and utilizing chemical solutions and plasma etching to remove the metal foil and solid solder mask material above the unsheltered portion of the conductor pattern.
Career Highlights
Ming-Sung Tsai has worked with several companies throughout his career, including Ultratera Corporation and S & S Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Tsai has collaborated with notable coworkers such as Chong-Ren Maa and Wan-Kuo Chih. These partnerships have further enhanced his work and led to advancements in technology.
Conclusion
Ming-Sung Tsai's contributions to semiconductor packaging and printed circuit board technology are noteworthy. His innovative patents and collaborations reflect his dedication to advancing the field. His work continues to influence the industry and inspire future innovations.