Company Filing History:
Years Active: 2004-2006
Title: Innovations by Inventor Wen-Sheng Su
Introduction
Wen-Sheng Su is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology. His work focuses on enhancing the reliability and structural integrity of semiconductor packages.
Latest Patents
One of his latest patents is titled "Multi-chip semiconductor package and fabrication method thereof." This invention provides a method for mounting multiple chips on a substrate while ensuring that the second chip is supported on a non-conductive material. This design effectively prevents conventional chip-crack problems, thereby enhancing the reliability of the fabricated package products.
Another significant patent is the "Strengthened window-type semiconductor package." This invention involves a substrate with an opening that allows an active surface of a chip to be exposed while being electrically connected to the substrate. The application of an elastic non-conductive material helps prevent cracking during thermal stress, particularly at the corners and edges of the chip.
Career Highlights
Wen-Sheng Su is currently employed at Ultratera Corporation, where he continues to develop innovative solutions in semiconductor technology. His expertise in the field has positioned him as a key contributor to advancements in semiconductor packaging.
Collaborations
Wen-Sheng has collaborated with several talented individuals, including Shiann-Tsong Tsai and Yu-Ming Hsu. Their combined efforts have led to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Wen-Sheng Su's contributions to semiconductor packaging through his innovative patents demonstrate his commitment to enhancing technology. His work not only addresses existing challenges but also paves the way for future advancements in the field.