Hsinchu, Taiwan

Jin-Chuan Bai


Average Co-Inventor Count = 1.3

ph-index = 4

Forward Citations = 73(Granted Patents)


Location History:

  • Taipei, TW (2002 - 2005)
  • Hsinchu, TW (2004 - 2005)

Company Filing History:


Years Active: 2002-2005

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8 patents (USPTO):Explore Patents

Title: Innovations of Jin-Chuan Bai

Introduction

Jin-Chuan Bai is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology and circuit board fabrication. With a total of eight patents to his name, Bai's work has been instrumental in advancing manufacturing processes in the electronics industry.

Latest Patents

One of his latest patents is a fabrication method of a circuit board. This method proposes a process where a core layer is formed with multiple conductive traces. Photo resist is applied on the terminals of these conductive traces. A non-solderable material is then applied over the core layer to cover the conductive traces, except for the insulating material. This non-solderable material is designed to be surface-flush with the insulating material, allowing the insulating material to be exposed. The insulating material is subsequently removed to expose the terminals of the conductive traces, which can be used as bond pads or bond fingers for solder balls, solder bumps, or bonding wires. This innovative approach allows for cost-effective fabrication and significantly improves the yield of circuit boards.

Another notable patent is related to a semiconductor device and its fabrication method. In this invention, a chip is placed in an opening formed in a substrate without coming into contact with it. An encapsulant fills the opening to encapsulate the chip, which reduces the overall height of the semiconductor device. Additionally, conductive elements on the substrate are also encapsulated, ensuring that their bottom sides are exposed and coplanar with the encapsulant. This design enhances the planarity of the semiconductor device, facilitating better electrical connections to external devices.

Career Highlights

Throughout his career, Jin-Chuan Bai has worked with several companies, including Ultratera Corporation and United Test Center Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and circuit board fabrication.

Collaborations

Bai has collaborated with notable colleagues such as Chung-Che Tsai and Huan-Ping Su. Their joint efforts have furthered advancements in their respective fields.

Conclusion

Jin-Chuan Bai's innovative patents and contributions to semiconductor technology and circuit board fabrication have made a significant impact in the electronics industry. His work continues to influence manufacturing processes and improve product yields.

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