The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Sep. 30, 2002
Jin-Chuan Bai, Hsinchu, TW;
Ultratera Corporation, Hsin-Chu, TW;
Abstract
A window-type semiconductor package and a fabrication method thereof are provided. A substrate having an opening is mounted with at least a chip in a manner that, a conductive area of an active surface of the chip is exposed to the opening, and electrically connected to the substrate by bonding wires formed through the opening. A non-conductive material is applied over the conductive area of the chip. An upper encapsulant is formed to encapsulate the chip, and a lower encapsulant is formed to encapsulate the bonding wires and the non-conductive material. The non-conductive material interposed between the chip and the lower encapsulant helps prevent the chip from cracking at end portions thereof due to shrinkage of the lower encapsulant, and also helps secure the bonding wires in position within the opening of the substrate without causing wire-sweeping, such that reliability and yield of the semiconductor package can be assured.