The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Sep. 12, 2017
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Shiann-Tsong Tsai, Hsinchu, TW;
Hsueh-Te Wang, Hsinchu, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/4832 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/5389 (2013.01); H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/43 (2013.01); H01L 24/46 (2013.01); H01L 24/48 (2013.01); H01L 24/75 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/4952 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02321 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03515 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/0529 (2013.01); H01L 2224/05347 (2013.01); H01L 2224/05439 (2013.01); H01L 2224/05562 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48491 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8123 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/18165 (2013.01);
Abstract
A semiconductor chip package includes a substrate; a semiconductor die mounted on the substrate, wherein the semiconductor die comprises a bond pad disposed on an active surface of the semiconductor die, and a passivation layer covering perimeter of the bond pad, wherein a bond pad opening in the passivation layer exposes a central area of the bond pad; a conductive paste post printed on the exposed central area of the bond pad; and a bonding wire secured to a top surface of the conductive paste post. The conductive paste post comprises copper paste.