logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

I-Hsuan Peng

This inventor holds 49 USPTO granted patents and 12 published patent applications and 17 EPO patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, Industrial Technology Research Institute. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: I-Hsuan Peng. Retrieved from https://idiyas.com/inventor/i-hsuan-peng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 49 

% Patents Active = 93.9

 

Average Co-Inventor Count = 3.9

ph-index = 6

Forward Citations = 126(Granted Patents)


Location History:

  • Jhudong Township, Hsinchu County, TW (2008 - 2009)
  • Hsinchu, TW (2006 - 2024)

Company Filing History:

goldMedal45 out of 5,091 
 
Mediatek Corporation
 patents
silverMedal4 out of 9,303 
 
Industrial Technology Research Institute
 patents

Years Active: 2006-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Package Structure
Electronic Package
Dummy MIM Capacitor Die
Stiffener Ring
Conductive Electromagnetic Shield
Lid Structure
Stacked Fan-Out Package
Improved Bandwidth
Heat Dissipation Performance
Active Surfaces
Annular Frame
Fabrication Method
49 patents (USPTO):Explore Patents
1. 12525549 - Semiconductor package structure (2026-01-13),
2. 12444715 - Semiconductor package structure (2025-10-14),
3. 12388026 - Electronic package with rotated semiconductor die (2025-08-12),
4. 12183723 - Semiconductor package with dummy MIM capacitor die (2024-12-31),
5. 12142598 - Semiconductor package structure having an annular frame with truncated corners (2024-11-12),
6. 12021031 - Semiconductor package structure (2024-06-25),
7. 11948895 - Semiconductor package structure (2024-04-02),
8. 11862578 - Semiconductor package structure (2024-01-02),
9. 11854930 - Semiconductor chip package and fabrication method thereof (2023-12-26),
10. 11830851 - Semiconductor package structure (2023-11-28),
11. 11830820 - Electronic package with rotated semiconductor die (2023-11-28),
12. 11728292 - Semiconductor package assembly having a conductive electromagnetic shield layer (2023-08-15),
13. 11728232 - Semiconductor package having a stiffener ring (2023-08-15),
14. 11688655 - Semiconductor package including lid structure with opening and recess (2023-06-27),
15. 11670596 - Semiconductor package structure (2023-06-06),

Title: Inventor I-Hsuan Peng: Revolutionizing Technology in Hsinchu

Introduction: I-Hsuan Peng is a visionary inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Peng holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse expertise and innovative mindset.

Career Highlights: With a career spanning over two decades, Peng has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Peng has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: I-Hsuan Peng's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field, with a lasting impact on the world of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…