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Teck-Chong Lee

This inventor holds 43 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging. Top assignees: Advanced Semiconductor Engineering, Inc., Ase (Shanghai) Inc., Ase Electronics Inc.. Active years: 2008-2026.

USPTO Granted Patents = 43 (Patent Applications = 13)

% Patents Active = 90.7

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 82(Granted Patents)

Company Filing History:

42 out of 1,962

Advanced Semiconductor Engineering, Inc.

where one patent can have more than one assignee

Years Active: 2008-2026

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Areas of Expertise:

Semiconductor Package

Manufacturing Method

Inductor

Capacitor

Passive Devices

Thermally Enhanced

Interposer

Integrated Passive Component

Electronic Device

43 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12581952 - Package structure and method for manufacturing the same (2026-03-17),

2. 12581668 - Semiconductor device packages including an inductor and a capacitor (2026-03-17),

3. 12557630 - Package structure with interposer encapsulated by an encapsulant (2026-02-17),

4. 12300602 - Semiconductor package structure and method for manufacturing the same (2025-05-13),

5. 12176259 - Semiconductor package structure (2024-12-24),

6. 12166009 - Semiconductor device packages and methods of manufacturing the same (2024-12-10),

7. 11894317 - Package structure and method for manufacturing the same (2024-02-06),

8. 11887928 - Package structure with interposer encapsulated by an encapsulant (2024-01-30),

9. 11855034 - Electronic device package and method of manufacturing the same (2023-12-26),

10. 11764311 - Optical device and electronic device (2023-09-19),

11. 11742324 - Semiconductor device packages and methods of manufacturing the same (2023-08-29),

12. 11637172 - Semiconductor device packages including an inductor and a capacitor (2023-04-25),

13. 11621220 - Assembly structure and method for manufacturing the same (2023-04-04),

14. 11605877 - Semiconductor device package and method of manufacturing the same (2023-03-14),

15. 11545427 - Capacitor bank structure and semiconductor package structure (2023-01-03),

Title: The Innovative Journey of Inventor Teck-Chong Lee

Introduction: Teck-Chong Lee, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Teck-Chong Lee's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights: Throughout his illustrious career, Teck-Chong Lee has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have revolutionized various industries, from healthcare to transportation.

Collaborations: Teck-Chong Lee has collaborated with leading tech companies, research institutions, and universities worldwide to further develop and implement his inventions. His collaborative efforts have led to the successful integration of his technologies into everyday life.

Conclusion: Teck-Chong Lee's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors. His impact on the world of technology is truly remarkable, and his legacy will undoubtedly endure for years to come.

Profile summary based on public USPTO records.

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