Chao-Fu Weng

This inventor holds 33 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Advanced Semiconductor Engineering, Inc., Ase (Shanghai) Inc.. Active years: 2003-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chao-Fu Weng. Retrieved from https://idiyas.com/inventor/chao-fu-weng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 (Patent Applications = 1)

% Patents Active = 93.9

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 236(Granted Patents)

Location History:

Tainan, TW (2003 - 2013)
Kaohsiung, TW (2012 - 2018)

Company Filing History:

32 out of 1,964

Advanced Semiconductor Engineering, Inc.

Years Active: 2003-2018

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Areas of Expertise:

Redistribution Layer

Semiconductor Substrate

Chip Packaging

Bump Manufacturing

Die-Bonding Method

Wafer-Level Package

Solder Ball Fabrication

Electro-Thinning Apparatus

Bumping Process

UBM Pads

Lead-Free Bumps

Burnt Fuse Pad

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9955590 - Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same (2018-04-24),

2. 8431007 - Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the same (2013-04-30),

3. 8288854 - Semiconductor package and method for making the same (2012-10-16),

4. 7581666 - Wire-bonding method for wire-bonding apparatus (2009-09-01),

5. 7547575 - Two-stage die-bonding method for simultaneous die-bonding of multiple dies (2009-06-16),

6. 7445944 - Packaging substrate and manufacturing method thereof (2008-11-04),

7. 7261828 - Bumping process (2007-08-28),

8. 7253519 - Chip packaging structure having redistribution layer with recess (2007-08-07),

9. 7144801 - Bumping process to increase bump height (2006-12-05),

10. 7064428 - Wafer-level package structure (2006-06-20),

11. 7015130 - Method for making UBM pads and bumps on wafer (2006-03-21),

12. 6989326 - Bump manufacturing method (2006-01-24),

13. 6967153 - Bump fabrication process (2005-11-22),

14. 6927964 - Structure for preventing burnt fuse pad from further electrical connection (2005-08-09),

15. 6921716 - Wafer bumping process (2005-07-26),

Title: The Innovative Journey of Chao-Fu Weng

Introduction: Chao-Fu Weng, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Chao-Fu Weng holds several patents in various fields, including technology, healthcare, and sustainable energy solutions. His recent patents focus on enhancing renewable energy sources and improving healthcare technologies for a better tomorrow.

Career Highlights: With a career spanning over two decades, Chao-Fu Weng has worked tirelessly to bring his innovative ideas to life. He has been recognized for his exceptional problem-solving skills and creative thinking, which have led to the development of cutting-edge technologies.

Collaborations: Throughout his career, Chao-Fu Weng has collaborated with leading research institutions, universities, and companies to further his inventions. His collaborative efforts have resulted in the successful implementation of his ideas in real-world applications.

Conclusion: Chao-Fu Weng's passion for innovation and dedication to making a positive impact on society through his inventions make him a true visionary in the world of inventors. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: