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For the Inventor, By the Inventor

Tainan, Taiwan

Chao-Fu Weng

USPTO Granted Patents = 33 

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 236(Granted Patents)


Location History:

  • Tainan, TW (2003 - 2013)
  • Kaohsiung, TW (2012 - 2018)

Company Filing History:

goldMedal32 out of 1,872 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal1 out of 3 
 
Ase (shanghai) Inc.
 patents

Years Active: 2003-2018

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33 patents (USPTO):Explore Patents
1. 9955590 - Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same (2018-04-24),
2. 8431007 - Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the same (2013-04-30),
3. 8288854 - Semiconductor package and method for making the same (2012-10-16),
4. 7581666 - Wire-bonding method for wire-bonding apparatus (2009-09-01),
5. 7547575 - Two-stage die-bonding method for simultaneous die-bonding of multiple dies (2009-06-16),
6. 7445944 - Packaging substrate and manufacturing method thereof (2008-11-04),
7. 7261828 - Bumping process (2007-08-28),
8. 7253519 - Chip packaging structure having redistribution layer with recess (2007-08-07),
9. 7144801 - Bumping process to increase bump height (2006-12-05),
10. 7064428 - Wafer-level package structure (2006-06-20),
11. 7015130 - Method for making UBM pads and bumps on wafer (2006-03-21),
12. 6989326 - Bump manufacturing method (2006-01-24),
13. 6967153 - Bump fabrication process (2005-11-22),
14. 6927964 - Structure for preventing burnt fuse pad from further electrical connection (2005-08-09),
15. 6921716 - Wafer bumping process (2005-07-26),

Title: The Innovative Journey of Chao-Fu Weng

Introduction: Chao-Fu Weng, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Chao-Fu Weng holds several patents in various fields, including technology, healthcare, and sustainable energy solutions. His recent patents focus on enhancing renewable energy sources and improving healthcare technologies for a better tomorrow.

Career Highlights: With a career spanning over two decades, Chao-Fu Weng has worked tirelessly to bring his innovative ideas to life. He has been recognized for his exceptional problem-solving skills and creative thinking, which have led to the development of cutting-edge technologies.

Collaborations: Throughout his career, Chao-Fu Weng has collaborated with leading research institutions, universities, and companies to further his inventions. His collaborative efforts have resulted in the successful implementation of his ideas in real-world applications.

Conclusion: Chao-Fu Weng's passion for innovation and dedication to making a positive impact on society through his inventions make him a true visionary in the world of inventors. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators worldwide.

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