The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Nov. 20, 2003
Chi-long Tsai, Taitung, TW;
Min-lung Huang, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
En-chieh Wu, Kaohsiung, TW;
Yang Hong-zen, Kaohsiung, TW;
Chi-Long Tsai, Taitung, TW;
Min-Lung Huang, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
En-Chieh Wu, Kaohsiung, TW;
Yang Hong-Zen, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A method for making UBM (Under Bump Metallurgy) pads and bumps on a wafer is disclosed. Openings are formed in a photoresist layer for forming bumps, a positive liquid photoresist is provided into the openings of the photoresist layer for forming bumps. The positive liquid photoresist is exposed and developed to modify the openings of the photoresist layer. Thus, bumps formed in the modified openings have precise bonding areas on the UBM layer. Using the bumps as a mask, UBM pads under the bumps are formed by etching the UBM layer, so that the reflowed bumps have a uniform height.