Kaohsiung, Taiwan

Chi-Long Tsai


Average Co-Inventor Count = 2.0

ph-index = 6

Forward Citations = 107(Granted Patents)


Location History:

  • Taitung, TW (2005 - 2007)
  • Kaohsiung, TW (2006 - 2009)

Company Filing History:


Years Active: 2005-2009

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11 patents (USPTO):Explore Patents

Title: Innovations of Chi-Long Tsai

Introduction

Chi-Long Tsai is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on improving the quality and reliability of wafer structures used in various electronic applications.

Latest Patents

One of his latest patents is a fabrication method of a wafer structure. This method includes steps such as providing a wafer with an active surface that has multiple pads, forming bumps on these pads, and applying an organic protective layer. This innovation not only enhances the quality of the wafer but also makes it oxidation-resistant, thereby preventing cold-joint issues during soldering to substrates. Another notable patent is the method for forming bump protective collars on a bumped wafer. This method involves creating a passivation layer and using reflowed bumps as a photo mask to form protective collars around the bumps, which significantly improves their reliability.

Career Highlights

Chi-Long Tsai is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor fabrication. His expertise and dedication have made him a valuable asset to the company and the industry.

Collaborations

He has collaborated with notable coworkers such as Min-Lung Huang and Chao-Fu Weng, contributing to various projects that enhance semiconductor technologies.

Conclusion

Chi-Long Tsai's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovations continue to pave the way for advancements in electronic applications.

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