The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2006
Filed:
Mar. 02, 2004
Chi-long Tsai, Taitung, TW;
Min-lung Huang, Kaohsiung, TW;
Chi-Long Tsai, Taitung, TW;
Min-Lung Huang, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The present invention provides a method for treating the wafer surface, suitable for removing residues on the wafer surface. The method includes forming a photo-sensitive material layer over the wafer surface covering the bumps and the under bump metallurgy layer on the wafer surface. Using the bumps as masks, the photo-sensitive material layer is exposed and developed, to expose the wafer surface between the bumps. A wet etching process is then performed to remove residues on the exposed wafer surface and then the remained photo-sensitive material layer is removed. Therefore, no residues remain on the wafer surface, and the yield of the bumps is increased.