The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Jan. 09, 2004
En-chieh Wu, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
Chi-long Tsai, Taitung, TW;
Min-lung Huang, Kaohsiung, TW;
Chia-ming Chuang, Fengshan, TW;
En-Chieh Wu, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Chi-Long Tsai, Taitung, TW;
Min-Lung Huang, Kaohsiung, TW;
Chia-Ming Chuang, Fengshan, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A method of forming a plurality of bumps over a wafer mainly comprises providing the wafer having a plurality of bonding pads formed thereon, forming an under bump metallurgy (UBM) layer over the bonding pads wherein the UBM layer includes an adhesive layer, for example a titanium (Ti) layer or an aluminum (Al) layer, and at least one electrically conductive layer formed on the adhesive layer, removing the portions of the electrically conductive layer located outside the bonding pads, forming a plurality of bumps over the residual portions of the electrically conductive layer disposed above the bonding pads, etching the adhesive layer located outside the bumps, and then reflowing the bumps.