The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2009
Filed:
Oct. 04, 2007
Ho-ming Tong, Taipei, TW;
Kao-ming Su, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
Teck-chong Lee, Kaohsiung, TW;
Chian-chi Lin, Tainan, TW;
Chia-jung Tsai, Tainan, TW;
Chih-nan Wei, Kaohsiung, TW;
Song-fu Yang, Kaohsiung, TW;
Ho-Ming Tong, Taipei, TW;
Kao-Ming Su, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Teck-Chong Lee, Kaohsiung, TW;
Chian-Chi Lin, Tainan, TW;
Chia-Jung Tsai, Tainan, TW;
Chih-Nan Wei, Kaohsiung, TW;
Song-Fu Yang, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.