The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Feb. 10, 2003
Ho-ming Tong, Taipei, TW;
Chun-chi Lee, Kaohsiung, TW;
Jen-kuang Fang, Pingtung Hsien, TW;
Min-lung Huang, Kaohsiung, TW;
Jau-shoung Chen, Hsinchu Hsien, TW;
Ching-huei Su, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
Yung-chi Lee, Kaohsiung, TW;
Yu-chen Chou, Kaohsiung, TW;
Tsung-hua Wu, Kaohsiung Hsien, TW;
Su Tao, Kaohsiung, TW;
Ho-Ming Tong, Taipei, TW;
Chun-Chi Lee, Kaohsiung, TW;
Jen-Kuang Fang, Pingtung Hsien, TW;
Min-Lung Huang, Kaohsiung, TW;
Jau-Shoung Chen, Hsinchu Hsien, TW;
Ching-Huei Su, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Yung-Chi Lee, Kaohsiung, TW;
Yu-Chen Chou, Kaohsiung, TW;
Tsung-Hua Wu, Kaohsiung Hsien, TW;
Su Tao, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A bump fabrication process for forming a bump over a wafer having a plurality of bonding pads thereon is provided. A patterned solder mask layer having a plurality of openings that exposes the respective bonding pads is formed over a wafer. The area of the opening in a the cross-sectional area through a the bottom-section as well as through a the top-section of the opening is smaller than the area of the opening in a the cross-sectional area through a the mid-section of the opening. Solder material is deposited into the opening and then a reflow process is conducted fusing the solder material together to form a spherical bump inside the opening. Finally, the solder mask layer is removed. In addition, a pre-formed bump may form on the bonding pad of the wafer prior to forming the patterned solder mask layer over the wafer having at least with an opening that exposes the pre-formed bump. Solder material is deposited into the openings and then a reflow process is conducted fusing the solder material and the pre-formed bump together to form a spherical bump. The pre-formed bump and the solder material may be fabricated using different constituents.