The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Dec. 27, 2006
Wei-chung Wang, Kaohsiung, TW;
Sung-mao Wu, Kaohsiung, TW;
Hsueh-an Yang, Kaohsiung, TW;
Kuo-pin Yang, Kaohsiung, TW;
Chian-chi Lin, Kaohsiung, TW;
Wei-Chung Wang, Kaohsiung, TW;
Sung-Mao Wu, Kaohsiung, TW;
Hsueh-An Yang, Kaohsiung, TW;
Kuo-Pin Yang, Kaohsiung, TW;
Chian-Chi Lin, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The invention relates to a microelectromechanical microphone packaging system. The microelectromechanical microphone packaging system comprises a substrate, a chip, a microelectromechanical microphone, a conductive glue, a non-conductive glue and a cover. The substrate has a first surface. The chip is mounted on the first surface of the substrate. The microelectromechanical microphone is mounted on the first surface of the substrate, and electrically connected to the chip. The chip is enclosed by the non-conductive glue. The non-conductive glue is enclosed by the conductive glue. The cover is mounted on the first surface of the substrate to form a containing space, and has an acoustic aperture. The microelectromechanical microphone packaging system utilizes the conductive glue enclosing the chip and the non-conductive glue to shield interference from outside noise and obtain a shielding effect. In addition, the cover does not need to be made of metal material.