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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Wei-Chung Wang

This inventor holds 15 USPTO granted patents and 1 published patent application. Top assignees: Advanced Semiconductor Engineering, Inc., Institute for Information Industry, Other. Active years: 2000-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Chung Wang. Retrieved from https://idiyas.com/inventor/wei-chung-wang-drx48ey5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 80.0

Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 225(Granted Patents)


Location History:

  • Kaohsiung Hsien, TW (2000 - 2008)
  • Kaoshiung, TW (2009)
  • Kaohsiung County, TW (2012)
  • Kaohsiung, TW (2002 - 2018)

Company Filing History:

goldMedal13 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal1 out of 638 
 
Institute for Information Industry
 patents
bronzeMedal1 out of 834,570 
Other
 patents

Years Active: 2000-2018

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15 patents (USPTO):Explore Patents
1. 10075237 - Visible light communication system and method (2018-09-11),
2. 8288853 - Three-dimensional package and method of making the same (2012-10-16),
3. 8158888 - Circuit substrate and method of fabricating the same and chip package structure (2012-04-17),
4. 8110928 - Stacked-type chip package structure and method of fabricating the same (2012-02-07),
5. 7945062 - Microelectromechanical microphone packaging system (2011-05-17),
6. 7811858 - Package and the method for making the same, and a stacked package (2010-10-12),
7. 7741152 - Three-dimensional package and method of making the same (2010-06-22),
8. 7642132 - Three-dimensional package and method of making the same (2010-01-05),
9. 7528053 - Three-dimensional package and method of making the same (2009-05-05),
10. 7491568 - Wafer level package and method for making the same (2009-02-17),
11. 7446404 - Three-dimensional package and method of making the same (2008-11-04),
12. 7410886 - Method for fabricating protective caps for protecting elements on a wafer surface (2008-08-12),
13. 6383846 - Method and apparatus for molding a flip chip semiconductor device (2002-05-07),
14. 6342443 - Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate (2002-01-29),
15. 6153939 - Flip-chip semiconductor device with enhanced reliability and (2000-11-28),

Title: The Innovative Journey of Wei-Chung Wang

Introduction: Wei-Chung Wang, a talented inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Wang's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a sustainable energy solution aimed at reducing carbon emissions.

Career Highlights: With a career spanning over two decades, Wang has established himself as a visionary in the tech industry. His work has been recognized globally, earning him prestigious awards for his innovative designs and forward-thinking approach.

Collaborations: Wang has collaborated with leading tech companies and research institutions to further develop his inventions. His partnerships have led to the successful implementation of his ideas in real-world applications, benefiting society as a whole.

Conclusion: Wei-Chung Wang's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology. His inventive spirit continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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