The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Nov. 28, 2006
Chi-chao Tseng, Hsinchu, TW;
Chi-Chao Tseng, Hsinchu, TW;
ASE (Shanghai) Inc., Shanghai, CN;
Abstract
A method of manufacturing a substrate for packaging ICs is disclosed, which coats a thin conductive layer on the bottom surface of the laminated circuit board, for electrically connecting the pad and the circuit pattern formed on the bottom surface after one line photolithography/etching step. The pad formed on the top surface of the laminated circuit board can be electrically connected to the power applied in the electroplating process through the electroplating layer in the through hole and the conductive layer. Hence, the times of line photolithography/etching steps required for the prior process can be reduced, thereby solving the issues of lowering yield caused by the line photolithography/etching steps.