Chi-Chao Tseng

Title: Innovations by Chi-Chao Tseng

Introduction

Chi-Chao Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit board manufacturing and integrated circuit packaging. With a total of two patents to his name, Tseng's work has advanced the technology used in these critical areas.

Latest Patents

Chi-Chao Tseng's latest patents include a manufacturing method of a circuit board and a method of manufacturing a substrate for packaging integrated circuits without multiple photolithography/etching steps. The first patent describes a process that begins with a substrate board featuring multiple through holes. A first metal layer is electro-less plated on the substrate's surface and through holes, followed by the plating of a second metal layer. This layered approach allows for the creation of a patterned circuit layer, culminating in the addition of a third metal layer. The second patent focuses on a method that coats a thin conductive layer on the bottom surface of a laminated circuit board. This innovation reduces the number of photolithography and etching steps required, thereby improving yield and efficiency in the manufacturing process.

Career Highlights

Throughout his career, Chi-Chao Tseng has worked with prominent companies such as Advanced Semiconductor Engineering, Inc. and ASE (Shanghai) Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and circuit board manufacturing.

Collaborations

Chi-Chao Tseng has collaborated with various professionals in his field, including Ming-Loung Lu, enhancing the innovation process through teamwork and shared expertise.

Conclusion

Chi-Chao Tseng's contributions to circuit board manufacturing and integrated circuit packaging demonstrate his innovative spirit and technical proficiency. His patents reflect a commitment to improving manufacturing processes and advancing technology in the semiconductor industry.