The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Sep. 14, 2006
Applicants:
Chi-chao Tseng, Hsinchu, TW;
Ming-loung LU, Kaohsiung, TW;
Inventors:
Chi-Chao Tseng, Hsinchu, TW;
Ming-Loung Lu, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A manufacturing method of a circuit board is provided. Firstly, a substrate board having a plurality of through holes is provided. Next, a first metal layer is electro-less plated on the surface of the substrate board and the surface of the through holes. Then, a second metal layer is plated on the first metal layer. After that, the second metal layer and the first metal layer are patterned to form a patterned circuit layer. Lastly, a third metal layer is plated on the patterned circuit layer.