Ming-Loung Lu

Title: The Innovations of Ming-Loung Lu

Introduction

Ming-Loung Lu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of circuit board fabrication, holding a total of 2 patents. His work is characterized by innovative processes that enhance the efficiency and effectiveness of circuit board manufacturing.

Latest Patents

Ming-Loung Lu's latest patents include a "Process of Fabricating a Circuit Board" and a "Manufacturing Method of Circuit Board." The first patent outlines a process that involves a dielectric layer, a circuit layer, and an insulation layer. In this process, the circuit layer is placed on the dielectric layer and features a pad region and a trace region. Notably, the thickness of the pad region is less than that of the trace region, which optimizes the circuit board's performance. The second patent describes a manufacturing method that begins with a substrate board containing multiple through holes. This method includes electro-less plating of a first metal layer on the substrate's surface and through holes, followed by the plating of a second metal layer. The patterned circuit layer is then formed by patterning both metal layers, culminating in the plating of a third metal layer.

Career Highlights

Ming-Loung Lu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the field of semiconductor technology. His expertise in circuit board fabrication has positioned him as a valuable asset to his company.

Collaborations

Ming-Loung Lu has collaborated with notable colleagues such as Chi-Chao Tseng and Shih-Chang Lee. Their combined efforts contribute to the advancement of technology in their field.

Conclusion

Ming-Loung Lu's contributions to circuit board fabrication through his innovative patents demonstrate his commitment to advancing technology. His work not only enhances manufacturing processes but also sets a standard for future innovations in the industry.