The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Aug. 05, 2009
Applicants:
Shih-chang Lee, Kaohsiung County, TW;
Kun-ching Chen, Tainan, TW;
Ming-loung LU, Kaohsiung, TW;
Chun-che Lee, Kaohsiung, TW;
Inventors:
Shih-Chang Lee, Kaohsiung County, TW;
Kun-Ching Chen, Tainan, TW;
Ming-Loung Lu, Kaohsiung, TW;
Chun-Che Lee, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process for fabricating a circuit board that includes a dielectric layer, a circuit layer, and an insulation layer. The circuit layer is disposed on the dielectric layer and has a pad region and a trace region. The insulation layer is disposed on the circuit layer and covers the trace region. Here, a thickness of the pad region is less than a thickness of the trace region.