The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Oct. 06, 2010
Chih-cheng Lee, Taipei County, TW;
Ho-ming Tong, Taipei, TW;
Chih-Cheng Lee, Taipei County, TW;
Ho-Ming Tong, Taipei, TW;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A circuit substrate includes the following elements. A conductive layer and a dielectric layer are disposed on an inner circuit structure in sequence, and a plurality of conductive blind vias are embedded in the dielectric layer and connected to a portion of the conductive layer. A plating seed layer is disposed between each of the first blind vias and the first conductive layer. Another conductive layer is disposed on the dielectric layer, wherein a portion of the another conductive layer is electrically connected to the conductive layer through the conductive blind vias. A third plating seed layer is disposed between the third conductive layer and each of the first blind vias and on the first dielectric layer.