The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Sep. 24, 2008
Ho-ming Tong, Taipei, TW;
Shin-hua Chao, Kaohsiung, TW;
Ming-chiang Lee, Kaohsiung, TW;
Tai-yuan Huang, Kaohsiung County, TW;
Chao-yuan Liu, Kaohsiung, TW;
Yung-cheng Huang, Kaohsiung, TW;
Teck-chong Lee, Kaohsiung, TW;
Jen-chieh Kao, Kaohsiung, TW;
Jau-shoung Chen, Hsinchu County, TW;
Ho-Ming Tong, Taipei, TW;
Shin-Hua Chao, Kaohsiung, TW;
Ming-Chiang Lee, Kaohsiung, TW;
Tai-Yuan Huang, Kaohsiung County, TW;
Chao-Yuan Liu, Kaohsiung, TW;
Yung-Cheng Huang, Kaohsiung, TW;
Teck-Chong Lee, Kaohsiung, TW;
Jen-Chieh Kao, Kaohsiung, TW;
Jau-Shoung Chen, Hsinchu County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically connected to the substrate. Then, a stencil having at least one opening and an air slot hole is disposed on an upper surface of the substrate strip, an air gap is formed between the stencil and the substrate strip, the air gap connects the opening and the air slot hole, and the chip is located in the opening. Finally, a liquid compound is formed into the opening of the stencil to encapsulate the chip, and a vacuum process is performed through the air slot hole and the air gap, so as to prevent the air inside the opening from being encapsulated by the liquid compound to become voids.