Ming-Chiang Lee

This inventor holds 20 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Advanced Semiconductor Engineering, Inc., Ase Electronics Inc.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Chiang Lee. Retrieved from https://idiyas.com/inventor/ming-chiang-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 (Patent Applications = 2)

% Patents Active = 90.0

Average Co-Inventor Count = 2.9

ph-index = 6

Forward Citations = 118(Granted Patents)

Company Filing History:

20 out of 1,968

Advanced Semiconductor Engineering, Inc.

where one patent can have more than one assignee

Years Active: 2009-2026

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Areas of Expertise:

Semiconductor Substrate

Chip Package

Embedded Component

Multi-layered Substrate

Thermally Enhanced Package

Wafer-level Package

Coreless Substrate

3D Fan-out

Manufacturing Method

Package Structure

Circuit Layer Pads

Conductive Posts

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12642109 - Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads (2026-05-26),

2. 12218077 - Semiconductor device package (2025-02-04),

3. 11398421 - Semiconductor substrate and method for manufacturing the same (2022-07-26),

4. 10797022 - Semiconductor device package and method of manufacturing the same (2020-10-06),

5. 10181438 - Semiconductor substrate mitigating bridging (2019-01-15),

6. 9578737 - Substrate structure and package structure using the same (2017-02-21),

7. 9190367 - Semiconductor package structure and semiconductor process (2015-11-17),

8. 8665605 - Substrate structure and package structure using the same (2014-03-04),

9. 8510940 - Method of fabricating a multi-trace via substrate (2013-08-20),

10. 8497585 - Chip package (2013-07-30),

11. 8416577 - Coreless substrate and method for making the same (2013-04-09),

12. 8387239 - Manufacturing method of embedded circuit substrate (2013-03-05),

13. 8372689 - Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof (2013-02-12),

14. 8320134 - Embedded component substrate and manufacturing methods thereof (2012-11-27),

15. 8288869 - Semiconductor package with substrate having single metal layer and manufacturing methods thereof (2012-10-16),

Title: The Innovative Journey of Ming-Chiang Lee

Introduction: Ming-Chiang Lee, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Lee's recent patents showcase his expertise in areas such as artificial intelligence, renewable energy, and biotechnology, demonstrating his commitment to driving innovation across various sectors.

Career Highlights: With a career spanning over two decades, Ming-Chiang Lee has established himself as a visionary inventor known for his ability to transform bold ideas into tangible solutions. His work has not only earned him recognition within the industry but has also inspired a new generation of inventors to push the boundaries of what is possible.

Collaborations: Throughout his career, Lee has collaborated with leading research institutions, universities, and companies to further his research and bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many of his projects.

Conclusion: Ming-Chiang Lee's passion for innovation, coupled with his relentless drive to create a positive impact on society, sets him apart as a true pioneer in the world of inventions. His journey serves as a testament to the power of creativity and perseverance in shaping a better future for all.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: