The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
May. 28, 2010
Min-yao Chen, Kaohsiung, TW;
Mao-chang Chuang, Kaohsiung, TW;
Ming-chiang Lee, Kaohsiung, TW;
Chien-hao Wang, Hukou Township, Hsinchu County, TW;
Min-Yao Chen, Kaohsiung, TW;
Mao-Chang Chuang, Kaohsiung, TW;
Ming-Chiang Lee, Kaohsiung, TW;
Chien-Hao Wang, Hukou Township, Hsinchu County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A method of fabricating a multi-trace via substrate is disclosed. A substrate at least having a first surface and a hole is provided, wherein the hole has a hole wall. A first conductive layer is formed on the entire surface of the substrate and the hole wall. A photoresist layer applied over the entire surface of the first conductive layer is selectively patterned to define a plurality of laterally separated regions on the first conductive layer. A patterned photoresist layer is used as a mask and a second conductive layer substantially thicker than the first conductive layer is electroplated on the laterally separated regions. The patterned photoresist layer is removed. The portion of the first conductive layer not covered by the second conductive layer is substantially removed to form a plurality of laterally separated traces extended on the first surface and through the hole.