The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
May. 13, 2010
Shih-fu Huang, Zhudong Township, TW;
Yuan-chang Su, Luzhu Township, TW;
Chia-cheng Chen, Zhongli, TW;
Kuang-hsiung Chen, Taoyuan, TW;
Ming-chiang Lee, Kaohsiung, TW;
Bernd Karl Appelt, Gulf Breeze, FL (US);
Chia-hsiung Hsieh, Yanshui Township, TW;
Shih-Fu Huang, Zhudong Township, TW;
Yuan-Chang Su, Luzhu Township, TW;
Chia-Cheng Chen, Zhongli, TW;
Kuang-Hsiung Chen, Taoyuan, TW;
Ming-Chiang Lee, Kaohsiung, TW;
Bernd Karl Appelt, Gulf Breeze, FL (US);
Chia-Hsiung Hsieh, Yanshui Township, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die.