Chia-Hsiung Hsieh

Title: Chia-Hsiung Hsieh: Innovator in Semiconductor Packaging

Introduction

Chia-Hsiung Hsieh is a prominent inventor based in Yanshui Township, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

One of Hsieh's latest patents is focused on a semiconductor package and the process for fabricating it. This patent describes a package carrier that includes a dielectric layer with multiple openings, a patterned electrically conductive layer embedded within the dielectric layer, and a series of electrically conductive posts. These posts are strategically placed in the openings, connecting to the patterned conductive layer. The design features a curved profile at the end of each post, enhancing the overall functionality of the semiconductor package. Additionally, a patterned solder resist layer is included, which exposes portions of the conductive layer corresponding to contact pads. This innovative semiconductor package comprises the package carrier, a chip, and an encapsulant that covers both the chip and the package carrier.

Career Highlights

Chia-Hsiung Hsieh is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics.

Collaborations

Hsieh has collaborated with notable colleagues, including Shih-Fu Huang and Yuan-Chang Su. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chia-Hsiung Hsieh's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. His patents and collaborative efforts continue to shape the future of electronic devices, ensuring they remain efficient and effective.