The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Jan. 27, 2010
Shih-fu Huang, Hsinchu County, TW;
Yuan-chang Su, Taoyuan County, TW;
Chia-hsiung Hsieh, Tainan County, TW;
Shih-Fu Huang, Hsinchu County, TW;
Yuan-Chang Su, Taoyuan County, TW;
Chia-Hsiung Hsieh, Tainan County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.