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For the Inventor, By the Inventor

Zhudong, Taiwan

Shih-Fu Huang

This inventor holds 14 USPTO granted patents and 2 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2012-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Fu Huang. Retrieved from https://idiyas.com/inventor/shih-fu-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 100.0

Average Co-Inventor Count = 5.1

ph-index = 7

Forward Citations = 201(Granted Patents)


Location History:

  • Hsinchu County, TW (2012 - 2013)
  • Zhudong Township, Hsinchu County, TW (2013)
  • Zhudong Township, TW (2012 - 2017)

Company Filing History:

goldMedal14 out of 1,964 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2012-2017

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14 patents (USPTO):Explore Patents
1. 9564346 - Package carrier, semiconductor package, and process for fabricating same (2017-02-07),
2. 9406658 - Embedded component device and manufacturing methods thereof (2016-08-02),
3. 9196597 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2015-11-24),
4. 9165900 - Semiconductor package and process for fabricating same (2015-10-20),
5. 8884424 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2014-11-11),
6. 8786062 - Semiconductor package and process for fabricating same (2014-07-22),
7. 8569894 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2013-10-29),
8. 8399776 - Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package (2013-03-19),
9. 8367473 - Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof (2013-02-05),
10. 8357861 - Circuit board, and chip package structure (2013-01-22),
11. 8330267 - Semiconductor package (2012-12-11),
12. 8320134 - Embedded component substrate and manufacturing methods thereof (2012-11-27),
13. 8288869 - Semiconductor package with substrate having single metal layer and manufacturing methods thereof (2012-10-16),
14. 8284561 - Embedded component package structure (2012-10-09),

Title: **Innovator Spotlight: Shih-Fu Huang**

Introduction

Shih-Fu Huang, an accomplished inventor from Zhudong, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio comprising 14 patents, his innovations have paved the way for advancements in electronic components and packaging methods.

Latest Patents

Huang's latest patents showcase his expertise in semiconductor packaging and embedded component devices. One of his notable patents, titled "Package Carrier, Semiconductor Package, and Process for Fabricating Same," outlines a sophisticated package carrier design that includes a dielectric layer and intricate electrically conductive patterns. This innovation enhances the reliability and efficiency of semiconductor devices.

Another significant patent, "Embedded Component Device and Manufacturing Methods Thereof," details an advanced embedded component device with a unique configuration. This device is characterized by a dielectric layer that strategically positions electrical interconnects and conductive layers, allowing for optimized electronic component integration.

Career Highlights

Huang is associated with Advanced Semiconductor Engineering, Inc., a leading company in semiconductor packaging and testing services. His role in the company has allowed him to explore cutting-edge technologies and contribute to critical projects in the semiconductor field. His work is instrumental in enhancing the functionality and performance of modern electronic devices.

Collaborations

Throughout his career, Huang has collaborated with talented professionals, including Yuan-Chang Su and Chia-Cheng Chen. These partnerships have fostered an environment of innovation, enabling them to tackle complex challenges in semiconductor development and manufacturing.

Conclusion

Shih-Fu Huang exemplifies the spirit of innovation within the semiconductor industry. His 14 patents reflect his dedication to advancing technology and improving electronic components. As a key contributor at Advanced Semiconductor Engineering, Inc., Huang continues to inspire future innovations in the field of semiconductors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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