The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Aug. 06, 2014
Applicant:

Advanced Semiconductor Engineering, Inc., Kaosiung, TW;

Inventors:

Yuan-Chang Su, Luzhu Township, TW;

Shih-Fu Huang, Zhudong Township, TW;

Chia-Cheng Chen, Madou Township, TW;

Tzu-Hui Chen, Taitung, TW;

Kuang-Hsiung Chen, Taoyuan, TW;

Pao-Ming Hsieh, Zhubei, TW;

Ming Chiang Lee, Kaohsiung, TW;

Bernd Karl Appelt, Gulf Breeze, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/28 (2013.01); H01L 23/296 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/5226 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/97 (2013.01); H01L 23/49838 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/078 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15311 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A multilayer substrate includes a first outer conductive patterned layer, a first insulating layer exposing a portion of the first outer conductive patterned layer to define a first set of pads, a second outer conductive patterned layer, and a second insulating layer exposing a portion of the second outer conductive patterned layer to define a second set of pads. The multilayer substrate further includes inner layers each with an inner conductive patterned layer, multiple inner conductive posts formed adjacent to the inner conductive patterned layer, and an inner dielectric layer, where the inner conductive patterned layer and the inner conductive posts are embedded in the inner dielectric layer, and a top surface of each of the inner conductive posts is exposed from the inner dielectric layer.


Find Patent Forward Citations

Su, Yuan-Chang. (2015). Semiconductor package with single sided substrate design and manufacturing methods thereof (U.S. Patent No. 9196597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9196597

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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